Through oxygen profile engineering, we fabricated W/AlOx/Al2O3/Pt bilayer memristors with a 250-nm feature size. The AlOx fabricated by sputtering serves as an oxygen vacancy source, whereas the Al2O3 deposited by atomic layer deposition acts as a dominant resistive switching (RS) layer. Our devices show forming-free RS behaviors with high speed (28 ns), uniform resistance distribution, large on/off ratio (similar to 10(3) @100K, similar to 10(3) @298K, and similar to 80@400K), and good retention. Besides, temperature stability with record high endurance from cryogenic to high-temperature (10(8) @100K, 10(10) @298K, and 10(7) @400K) is demonstrated, to the best of our knowledge.