Bonding Properties of Cu Paste in Low Temperature Pressureless Processes

被引:2
作者
Konno, Satoshi [1 ]
Yamauchi, Shinichi [1 ]
Hattori, Takashi [1 ]
Anai, Kei [1 ]
机构
[1] Mitsui Min & Smelting Co Ltd, Business Creat Sect, 1333-2 Haraichi, Ageo, Saitama, Japan
来源
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022) | 2022年
关键词
Copper sinter; Power electronics; Shear strength; Sound acoustic tomography; Pressureless sintering; Bonding material; Formic acid; Thermal cycling test;
D O I
10.1109/ECTC51906.2022.00183
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study suggests a newly developed pressureless type Cu sinter paste as a bonding material for power electronics. At ECTC2020, we reported on our pressure type Cu paste, but this time we will report on our newly developed pressureless type Cu paste. In this study, we evaluated both the initial bonding properties of the Cu paste and bonding properties after the reliability test. The Au or Ag metallized Si dummy die and TO-247 leadframe were used for evaluation. The bonding sample was prepared by sintering at 200 degrees C for 60 minutes in a formic acid atmosphere. As indicated by Scanning Acoustic Tomography (SAT) observation, die shear test, and cross-sectional observation as evaluation of the initial bonding state, the bonding state was good. The result of Thermal Cycling Test (TCT) as a reliability test demonstrated that the bonding sample maintained a good bonding state. The newly developed Cu paste can be expected to be as a bonding material for power electronics.
引用
收藏
页码:1133 / 1137
页数:5
相关论文
共 50 条
  • [31] Large area pressureless Cu-Cu bonding using formic acid-treated Cu particles for power device packaging
    Xu, Yu
    Dai, Dongfang
    Yang, Renbin
    Qian, Jing
    Wang, Ping
    Chen, Xianping
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [32] Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid
    Li, Wen-Hua
    Lin, Pei-Syuan
    Chen, Chen-Ni
    Dong, Teng-Yuan
    Tsai, Chi-Hang
    Kung, Wan-Ting
    Song, Jenn-Ming
    Chiu, Ying-Ta
    Yang, Ping-Feng
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 613 : 372 - 378
  • [33] Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering
    Yuan Li
    Hongyang Jing
    Yongdian Han
    Lianyong Xu
    Guoquan Lu
    Journal of Electronic Materials, 2016, 45 : 3003 - 3012
  • [34] Low-temperature diffusion bonding of W/Mo joints with a thin Cu interlayer
    Rao, Mei
    Zhang, Jian
    Ding, Jiahui
    Luo, Guoqiang
    Shen, Qiang
    Zhang, Lianmeng
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2018, 262 : 422 - 429
  • [35] Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
    Yuan, Yulei
    Wu, Houya
    Li, Junjie
    Zhu, Pengli
    Sun, Rong
    APPLIED SURFACE SCIENCE, 2021, 570
  • [36] Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering
    Li, Yuan
    Jing, Hongyang
    Han, Yongdian
    Xu, Lianyong
    Lu, Guoquan
    JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (06) : 3003 - 3012
  • [37] Pressureless Large-Area (15 x 15 mm2) Bonding by Novel Silver Paste for WBG Packaging
    Zhang, Bowen
    Lu, Xinyan
    Xie, Yilong
    Hou, Zhaozheng
    Pan, Weijian
    Mei, Yun-Hui
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [38] Enhancing Properties of Low-temperature Pressureless Ag Sinter-joining by Optimizing Solvents and Hybrid Particles
    Li, Yitian
    Wang, Yujian
    Yan, Haidong
    Li, Wanli
    Zhang, Jie
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [39] Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging
    Wu, Yongchao
    Zou, Guisheng
    Wang, Shuaiqi
    Guo, Wei
    Zhang, Hongqiang
    Peng, Peng
    Feng, Bin
    Liu, Lei
    APPLIED SURFACE SCIENCE, 2022, 603
  • [40] Low temperature pressureless sintering of sol-gel derived mullite
    Amutharani, D
    Gnanam, FD
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1999, 264 (1-2): : 254 - 261