Demonstration of Integrated Micro-Electro-Mechanical Relay Circuits for VLSI Applications

被引:133
作者
Spencer, Matthew [1 ]
Chen, Fred [2 ]
Wang, Cheng C. [3 ]
Nathanael, Rhesa [1 ]
Fariborzi, Hossein [2 ]
Gupta, Abhinav [1 ]
Kam, Hei [1 ]
Pott, Vincent [1 ]
Jeon, Jaeseok [1 ]
Liu, Tsu-Jae King [1 ]
Markovic, Dejan [3 ]
Alon, Elad [1 ]
Stojanovic, Vladimir [2 ]
机构
[1] Univ Calif Berkeley, Berkeley, CA 94720 USA
[2] MIT, Cambridge, MA 02142 USA
[3] Univ Calif Los Angeles, Los Angeles, CA 90095 USA
基金
美国国家科学基金会;
关键词
Adders; digital circuits; MEM relays; microelectromechanical devices; minimum energy point; very-large-scale integration;
D O I
10.1109/JSSC.2010.2074370
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents measured results from test chips containing circuits implemented with micro-electro-mechanical (MEM) relays. The relay circuits designed on these test chips illustrate a range of important functions necessary for the implementation of integrated VLSI systems and lend insight into circuit design techniques optimized for the physical properties of these devices. To explore these techniques a hybrid electro-mechanical model of the relays' electrical and mechanical characteristics has been developed, correlated to measurements, and then also applied to predict MEM relay performance if the technology were scaled to a 90 nm technology node. A theoretical, scaled, 32-bit MEM relay-based adder, with a single-bit functionality demonstrated by the measured circuits, is found to offer a factor of ten energy efficiency gain over an optimized CMOS adder for sub-20 MOPS throughputs at a moderate increase in area.
引用
收藏
页码:308 / 320
页数:13
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