Modeling particle redeposition in ion-beam erosion processes under normal incidence

被引:11
作者
Anspach, Nils [1 ]
Linz, Stefan J. [1 ]
机构
[1] Univ Munster, Inst Theoret Phys, D-48149 Munster, Germany
来源
JOURNAL OF STATISTICAL MECHANICS-THEORY AND EXPERIMENT | 2010年
关键词
Sputter erosion (theory); DIFFERENTIAL SPUTTERING YIELDS; SURFACES; GROWTH; DOTS;
D O I
10.1088/1742-5468/2010/06/P06023
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
A conceptually simple mesoscopic solid-on-solid type block model for the potential redeposition effect during spatio-temporal evolution of surfaces under normal ion-beam erosion is developed and investigated in considerable detail. This model focuses on redeposition only while neglecting other surface effects and is kept one-dimensional to allow for an analysis of large systems on long timescales. After introducing the model we discuss the evolution of the mean height and the root mean square roughness for different initial surface profiles and process parameters. The results are then compared to experiments and the recently proposed non-locally stabilized Kuramoto-Sivashinsky equation in order to discuss whether particle redeposition might be the potential origin of the non-local damping term in that equation.
引用
收藏
页数:27
相关论文
共 34 条
[1]  
BARABASI AL, 2006, FRACTAL CONCEPTS SUR, P44
[2]   ANGULAR-DISTRIBUTION AND DIFFERENTIAL SPUTTERING YIELDS FOR LOW-ENERGY LIGHT-ION IRRADIATION OF POLYCRYSTALLINE NICKEL AND TUNGSTEN [J].
BAY, HL ;
BOHDANSKY, J ;
HOFER, WO ;
ROTH, J .
APPLIED PHYSICS, 1980, 21 (04) :327-333
[3]   Temporal evolution of dot patterns during ion sputtering [J].
Bobek, T ;
Facsko, S ;
Kurz, H ;
Dekorsy, T ;
Xu, M ;
Teichert, C .
PHYSICAL REVIEW B, 2003, 68 (08)
[4]   THEORY OF RIPPLE TOPOGRAPHY INDUCED BY ION-BOMBARDMENT [J].
BRADLEY, RM ;
HARPER, JME .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (04) :2390-2395
[5]   The physics and applications of ion beam erosion [J].
Carter, G .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2001, 34 (03) :R1-R22
[6]   Making waves: Kinetic processes controlling surface evolution during low energy ion sputtering [J].
Chan, Wai Lun ;
Chason, Eric .
JOURNAL OF APPLIED PHYSICS, 2007, 101 (12)
[7]   Surface roughening in shadowing growth and etching in 2+1 dimensions [J].
Drotar, JT ;
Zhao, YP ;
Lu, TM ;
Wang, GC .
PHYSICAL REVIEW B, 2000, 62 (03) :2118-2125
[8]   Mechanisms for plasma and reactive ion etch-front roughening [J].
Drotar, JT ;
Zhao, YP ;
Lu, TM ;
Wang, GC .
PHYSICAL REVIEW B, 2000, 61 (04) :3012-3021
[9]   Surface roughening in low-pressure chemical vapor deposition [J].
Drotar, JT ;
Zhao, YP ;
Lu, TM ;
Wang, GC .
PHYSICAL REVIEW B, 2001, 64 (12)
[10]   Sputtering yields [J].
Eckstein, W. .
VACUUM, 2008, 82 (09) :930-934