High density packaging of the passive components in an automotive DC/DC converter

被引：26

作者：

Gerber, M ^{[1
]}

Ferreira, JA

Hofsajer, IW

Seliger, N

机构：

[1] Delft Univ Technol, Fac Elect Engn, EWI Fac, NL-2600 GA Delft, Netherlands

[2] Rand Afrikaans Univ, Ind Elect Technol Res Corp, ZA-2006 Auckland Pk, South Africa

[3] Siemens AG, Corp Technol Dept, D-81370 Munich, Germany

来源：

IEEE TRANSACTIONS ON POWER ELECTRONICS | 2005年 / 20卷 / 02期

关键词：

converter module; thermal performance;

D O I：

10.1109/TPEL.2004.843020

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a very high power density dc/dc converter module for automotive applications is investigated. The 14-V/42-V converter is specified to operate at a power level of 2.1 kW with a water cooled heat sink at 85 degrees C. The design and implementation of very high density passive components are discussed. Using the results of the passive component design, a prototype converter is built, achieving a final power density of 170 W/in(3). The thermal performance of the passive components and the converter module under different electrical and thermal excitations is investigated and recorded. Results are presented over the full excitation range.

引用

页码：268 / 275

页数：8

共 9 条

[1]

DEUTY S, 2000, P APPL POWER ELECT C, V2, P675

[2]

HOFSAJER IW, 1995, P IND APPL ANN M, V1, P891

[3]

Huljak R. J., 2000, APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058), P10, DOI 10.1109/APEC.2000.826076

[4]

JIANKUN H, 1997, P IND APPL ANN M, V2, P1147

[5]

MARAIS SJ, 1997, P PESC 97, V2, P1143

[6]

MITTER CS, 1997, P WESC 97 C, V97, P281

[7]

NEUBERT J, 2000, I ELECT ENG REV, P21

[8] Consequences for automotive relays of a 42 VDC power network in vehicles [J].

Schoepf, TJ ;

Rieder, WE .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01) :177-182

[9] DBC substrates as a base for power MCM's [J].

Schulz-Harder, J .

PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, :315-320

← 1 →