The Thermal Properties of Glass Fiber Reinforced Epoxy Composites with and without Fillers

被引:21
作者
Suchitra, M. [1 ,2 ]
Renukappa, N. M. [2 ]
机构
[1] Vidyavardhaka Coll Engn, Dept Elect & Commun Engn, Mysore 570002, Karnataka, India
[2] Sri Jayachamarajendra Coll Engn, Dept Elect & Commun Engn, Mysore 570006, Karnataka, India
关键词
fiber reinforced epoxy; glass transition temperature; pultrusion; scanning electron microscope; ultrasonication; CONDUCTIVITY; RESIN;
D O I
10.1002/masy.201400227
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
An experimental study has been carried out in order to investigate the thermal properties of glass fiber reinforced epoxy (G-E) composite with inorganic nano and micro fillers namely silica, alumina and aluminatrihydrate. The hybrid composites were fabricated by ultrasonication and pultrusion techniques. Morphological characterization was carried out by Scanning electron microscope (SEM) and the micro-graphs revealed an improved dispersion quality of fillers in the G-E composite. The thermal conductivity, glass transition temperature, thermal stability and coefficient of thermal expansion were investigated as per ASTM standards. The results reveal that the best performance was found to be in Al2O3+SiO2+ATH+G-E hybrid composite.
引用
收藏
页码:117 / 122
页数:6
相关论文
共 11 条
  • [1] Hamza M. S., 2013, J ENG TECH A, V31, P13
  • [2] Thermal properties of composites filled with different fillers
    Han, Z.
    Wood, J. W.
    Herman, H.
    Zhang, C.
    Stevens, G. C.
    [J]. CONFERENCE RECORD OF THE 2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRICAL INSULATION, VOLS 1 AND 2, 2008, : 497 - +
  • [3] Low percolation thresholds of electrical conductivity and rheology in poly(ethylene terephthalate) through the networks of multi-walled carbon nanotubes
    Hu, GJ
    Zhao, CG
    Zhang, SM
    Yang, MS
    Wang, ZG
    [J]. POLYMER, 2006, 47 (01) : 480 - 488
  • [4] Development of conducting adhesive materials for microelectronic applications
    Kang, SK
    Purushothaman, S
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) : 1314 - 1318
  • [5] Enhanced thermal conductivity of polymer composites filled with hybrid filler
    Lee, GW
    Park, M
    Kim, J
    Lee, JI
    Yoon, HG
    [J]. COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2006, 37 (05) : 727 - 734
  • [6] Nagaprasadnaidu G., 2011, INT J FIBER TEX RES, P28
  • [7] The effects of alumina nanoparticle on the properties of an epoxy resin system
    Omrani, Abdollah
    Simon, Leonardo C.
    Rostami, Abbas A.
    [J]. MATERIALS CHEMISTRY AND PHYSICS, 2009, 114 (01) : 145 - 150
  • [8] Panda P., 2013, J COMPOS MAT
  • [9] Thermal conductivity of polymer composites with close-packed structure of nano and micro fillers
    Sanada, K.
    Tada, Y.
    Shindo, Y.
    [J]. COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2009, 40 (6-7) : 724 - 730
  • [10] Tawman I. H., 2000, INT COMMUN HEAT MASS, V27, P253