Solidification behaviour of rapidly quenched Cu-Sn alloys

被引:4
|
作者
Mahmoudi, J [1 ]
Fredriksson, H [1 ]
机构
[1] Royal Inst Technol, Dept Mat Proc, Stockholm, Sweden
来源
MATERIALS TRANSACTIONS JIM | 2000年 / 41卷 / 11期
关键词
rapid; solidification; latent heat; vacancies; copper-tin; alloys;
D O I
10.2320/matertrans1989.41.1575
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A series of solidification experiments using DTA furnace were performed on different Cu-Sn alloys. The undercooling, cooling rates of the liquid and the solid states, solidification times and temperatures were evaluated from the curves. The cooling curves for different samples and alloys were simulated using a FEM solidification program. The heat transfer coefficient and the heat of fusion were evaluated. The calculated fraction of solid formed before quenching has been compared with the experimental result. It was found that the calculated values of the heat of fusion were much lower than the tabulated ones. The fraction of solid was also found to be much higher than those calculated theoretically. It is proposed that a large number of vacancies form during rapid solidification and that they condense during and after the solidification. The influence of these defects on the thermodynamics and solidification of the alloys has been evaluated.
引用
收藏
页码:1575 / 1582
页数:8
相关论文
共 50 条
  • [31] Characteristics of ultrahigh electrical conductivity for Cu-Sn alloys
    Zhang, J.
    Cui, X.
    Wang, Y.
    Yang, Y.
    Lin, J.
    MATERIALS SCIENCE AND TECHNOLOGY, 2014, 30 (04) : 506 - 509
  • [32] Electordeposition of Cu-Sn alloys from tripolyphosphate bath
    Kume, M.
    Oki, T.
    Hyomen gijutsu, 1995, 46 (09): : 829 - 833
  • [33] Thermodynamic and microscopic structure of liquid Cu-Sn alloys
    Adhikari, D.
    Jha, I. S.
    Singh, B. P.
    PHYSICA B-CONDENSED MATTER, 2010, 405 (07) : 1861 - 1865
  • [34] Titanium in Cast Cu-Sn Alloys-A Review
    Manu, Karthik
    Jezierski, Jan
    Ganesh, Madikkamadom Radhakrishnan Sai
    Shankar, Karthik Venkitaraman
    Narayanan, Sudarsanan Aswath
    MATERIALS, 2021, 14 (16)
  • [35] Process and theoretical research on electroplating Cu-Sn alloys of low Sn
    Ding, Lifeng
    Chen, Chongyan
    Li, Qiang
    Yuan, Jinxia
    Li, Hongdao
    Xue, Yanfeng
    Dong, Hongmei
    Li, Baoyi
    Niu, Yulan
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 2021, 51 (09) : 1287 - 1299
  • [36] EFFECT OF IRRADIATION ON PHASE TRANSFORMATIONS IN CU-SN AND CU-SN-PU ALLOYS
    KONOBEEVSKI, ST
    LEVITSKI, BM
    PANTELEEV, LD
    DUBROVIN, KP
    JOURNAL OF NUCLEAR MATERIALS, 1962, 5 (03) : 317 - 325
  • [37] A Mossbauer study on the mechanically alloyed Cu-Sn alloys
    Yang, YZ
    Zhu, YL
    Li, QS
    Ma, XM
    Dong, YD
    Chuang, YZ
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 1998, 14 (06) : 551 - 554
  • [38] An experimental investigation on the solubility of Zr in Cu-Sn alloys
    Pi, Zhao-hui
    Li, Guang-qiang
    Xiao, Yan-ping
    Zhang, Zhan
    Zhao, Zhuo
    Yang, Yong-xiang
    ADVANCES IN MATERIALS AND MATERIALS PROCESSING IV, PTS 1 AND 2, 2014, 887-888 : 324 - +
  • [39] Calorimetric investigations of liquid Cu-Sb, Cu-Sn and Cu-Sn-Sb alloys
    Lee, J.J.
    Kim, B.J.
    Min, W.S.
    Journal of Alloys and Compounds, 1993, 202 (1-2) : 237 - 242