Solidification behaviour of rapidly quenched Cu-Sn alloys

被引:4
|
作者
Mahmoudi, J [1 ]
Fredriksson, H [1 ]
机构
[1] Royal Inst Technol, Dept Mat Proc, Stockholm, Sweden
来源
MATERIALS TRANSACTIONS JIM | 2000年 / 41卷 / 11期
关键词
rapid; solidification; latent heat; vacancies; copper-tin; alloys;
D O I
10.2320/matertrans1989.41.1575
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A series of solidification experiments using DTA furnace were performed on different Cu-Sn alloys. The undercooling, cooling rates of the liquid and the solid states, solidification times and temperatures were evaluated from the curves. The cooling curves for different samples and alloys were simulated using a FEM solidification program. The heat transfer coefficient and the heat of fusion were evaluated. The calculated fraction of solid formed before quenching has been compared with the experimental result. It was found that the calculated values of the heat of fusion were much lower than the tabulated ones. The fraction of solid was also found to be much higher than those calculated theoretically. It is proposed that a large number of vacancies form during rapid solidification and that they condense during and after the solidification. The influence of these defects on the thermodynamics and solidification of the alloys has been evaluated.
引用
收藏
页码:1575 / 1582
页数:8
相关论文
共 50 条
  • [21] Low Temperature Cu-Sn Bonding by Isothermal Solidification Technology
    Rong, Yibo
    Cai, Jian
    Wang, Shuidi
    Jia, Songliang
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 20 - 22
  • [22] IMPLANTATION INDUCED CU-SN ALLOYS ANALYZED BY RBS
    HENRIKSEN, O
    PERRERA, B
    JOHNSON, E
    JOHANSEN, A
    SARHOLTKRISTENSEN, L
    WOOD, JV
    ZYSIN, Y
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1986, 15 (1-6): : 254 - 259
  • [23] Mossbauer study on the mechanically alloyed Cu-Sn alloys
    Yang, Yuanzheng
    Zhu, Youlan
    Li, Qiaoshen
    Ma, Xueming
    Dong, Yuanda
    Chuang, Yuzhi
    Journal of Materials Science and Technology, 1998, 14 (06): : 551 - 554
  • [24] MECHANISM OF THE STRAIN OF THE MARTENSITIC PHASES OF CU-SN ALLOYS
    LUSHANKIN, IA
    RUSSIAN METALLURGY, 1992, (04): : 142 - 146
  • [25] ISOMERIC SHIFT OF SN119 NUCLEI IN CU-SN ALLOYS
    BYKOV, VN
    KRIZHANS.LM
    ROGOZEV, BI
    RUDNEV, II
    FEDOROVS.AE
    SOVIET PHYSICS SOLID STATE,USSR, 1969, 10 (09): : 2267 - +
  • [26] Electrodeposition of Cu-Sn alloys: theoretical and experimental approaches
    Heidari, G.
    Khoie, S. M. Mousavi
    Abrishami, M. Ebrahimizadeh
    Javanbakht, M.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (03) : 1969 - 1976
  • [27] Modeling of peritectic coupled growth in Cu-Sn alloys
    Valloton, J.
    Dantzig, J. A.
    Plapp, M.
    Rappaz, M.
    ACTA MATERIALIA, 2013, 61 (15) : 5549 - 5560
  • [28] FLUIDITY OF Cu-Sn ALLOYS RELATED WITH CRYSTALLIZATION.
    Oya, Shigeo
    Sayashi, Mamoru
    Kambe, Hiroshi
    Report of the Castings Research Laboratory, Waseda University, 1982, (33): : 15 - 23
  • [29] Electroplating of Cu-Sn alloys from sulfate baths
    Noyanova, GA
    Kosmodamianskaya, LV
    Tyutina, KM
    PROTECTION OF METALS, 1999, 35 (06): : 559 - 562
  • [30] Rapidly quenched Cu-Ni-P alloys
    Vavilova, VV
    Kovneristyi, YK
    INORGANIC MATERIALS, 1997, 33 (09) : 910 - 915