Solidification behaviour of rapidly quenched Cu-Sn alloys

被引:4
|
作者
Mahmoudi, J [1 ]
Fredriksson, H [1 ]
机构
[1] Royal Inst Technol, Dept Mat Proc, Stockholm, Sweden
来源
MATERIALS TRANSACTIONS JIM | 2000年 / 41卷 / 11期
关键词
rapid; solidification; latent heat; vacancies; copper-tin; alloys;
D O I
10.2320/matertrans1989.41.1575
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A series of solidification experiments using DTA furnace were performed on different Cu-Sn alloys. The undercooling, cooling rates of the liquid and the solid states, solidification times and temperatures were evaluated from the curves. The cooling curves for different samples and alloys were simulated using a FEM solidification program. The heat transfer coefficient and the heat of fusion were evaluated. The calculated fraction of solid formed before quenching has been compared with the experimental result. It was found that the calculated values of the heat of fusion were much lower than the tabulated ones. The fraction of solid was also found to be much higher than those calculated theoretically. It is proposed that a large number of vacancies form during rapid solidification and that they condense during and after the solidification. The influence of these defects on the thermodynamics and solidification of the alloys has been evaluated.
引用
收藏
页码:1575 / 1582
页数:8
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