Electronic Thermal Management by Nanodiamonds

被引：0

作者：

Barbini, Patrizio ^{[1
,2
]}

Angjellari, Mariglen ^{[1
,2
]}

Gay, Stefano ^{[1
]}

Orlanducci, Silvia ^{[1
]}

Terranova, Maria Letizia ^{[1
,2
]}

Tamburri, Emanuela ^{[1
,2
]}

Rossi, Marco ^{[2
,3
,4
]}

Savi, Damiano ^{[2
]}

机构：

[1] Univ Roma Tor Vergata, Dip Sci & Tecnol Chim, MinimaLab, I-00133 Rome, Italy

[2] NanoShare Srl, I-00131 Rome, Italy

[3] Univ Roma La Sapienza, Dip Sci Base & Applicate Ingn, I-00137 Rome, Italy

[4] Univ Roma La Sapienza, Ctr Ric Nanotecnol Applicate Ingn CNIS, I-00137 Rome, Italy

来源：

2015 IEEE 15TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO) | 2015年

关键词：

nanodiamond; thermal management; HOT-PLATE APPARATUS; CONDUCTIVITY;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper are presented nanodiamond based materials for Thermal Management and the setup allowing to measure the thermal conductivity of these materials.

引用

页码：916 / 919

页数：4

共 50 条

[31] Advances in composite materials for thermal management in electronic packaging
Zweben, C
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1998, 50 (06): : 47 - 51
[32] Active Solder Joining of Thermal Management & Electronic Packaging
Smith, Ronald W.
Redd, Randall R.
BRAZING AND SOLDERING, PROCEEDINGS, 2006, : 79 - 82
[33] Miniaturized Frictionless Fan Concept for Thermal Management of Electronic
Schacht, Ralph
Hausdorf, Alexander
Wunderle, Bernhard
Michel, Bernd
2012 18TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2012, : 111 - 114
[34] Thermal Management on IGBT Power Electronic Devices and Modules
Qian, Cheng
Gheitaghy, Amir Mirza
Fan, Jiajie
Tang, Hongyu
Sun, Bo
Ye, Huaiyu
Zhang, Guoqi
IEEE ACCESS, 2018, 6 : 12868 - 12884
[35] Thermal Management of Electronic and Electrical Devices in Automobile Environment
Nakayama, Wataru
Suzuki, Osamu
Hara, Yoshikatsu
2009 IEEE VEHICLE POWER AND PROPULSION CONFERENCE, VOLS 1-3, 2009, : 541 - 548
[36] The design of cold plates for the thermal management of electronic equipment
Sparrow, Ephraim M.
Chevalier, Paul W.
Abraham, John P.
HEAT TRANSFER ENGINEERING, 2006, 27 (07) : 6 - 16
[37] Wide bandgap materials in thermal management of electronic structures
Gielisse, Peter J.
Niculescu, Halina
Tremblay, Jason
Achmatowicz, Selim
Jakobowski, Margaret
Zwierkowska, Elzbieta
Golonka, Leszek
Journal of Wide Bandgap Materials, 2001, 8 (3-4): : 261 - 275
[38] Comparative analysis of thermal interface materials for effective thermal management of electronic devices
Husain, Saddam
Asif, Mohammad
Khan, Khursheed Anwar
EXPERIMENTAL HEAT TRANSFER, 2024,
[39] Effect of interface morphology on thermal contact resistance in thermal management of electronic devices
Chen, Yu-Zheng
Feng, Shi-Wei
Zhang, Ya-Min
He, Xin
Bai, Kun
Li, Xuan
INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2022, 36 (17):
[40] Mechanical and electronic properties of ultrathin nanodiamonds under uniaxial compressions
Jiang, Xue
Zhao, Jijun
Zhuang, Chunqiang
Wen, Bin
Jiang, Xin
DIAMOND AND RELATED MATERIALS, 2010, 19 (01) : 21 - 25

← 1 2 3 4 5 →