Integrated electrical and thermal modeling and analysis of IPEMs

被引：7

作者：

Chen, JZ ^{[1
]}

Wu, YX ^{[1
]}

Borojevich, DS ^{[1
]}

Bohn, JH ^{[1
]}

机构：

[1] Virginia Polytech Inst & State Univ, Bradley Dept Elect & Comp Engn, Ctr Power Elect Syst, Blacksburg, VA 24061 USA

来源：

COMPEL 2000: 7TH WORKSHOP ON COMPUTERS IN POWER ELECTRONICS, PROCEEDINGS | 2000年

关键词：

D O I：

10.1109/CIPE.2000.904686

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The need for integrated analysis and design tools is becoming more evident, especially when Integrated Power Electronics Module (IPEM) is concerned. The whole procedure of developing IPEM needs the support from integrated tools. In this paper, a set of IPEM models has been developed. This includes 3D solid model by I-DEAS, parasitic model by Maxwell, thermal model by FLOTHERM and electrical model by Saber. The exchange of geometry information among these models has been achieved. Furthermore, based on these models, this paper explores the tradeoff between minimizing parasitics and improving thermal performance.

引用

页码：24 / 27

页数：4

共 10 条

[1] *AN INC, SAB US GUID
[2] *ANS US, PROIPO1001996 ANS US
[3] *CEDRAT, INCA VERS 1 05
[4] *FLOM LTD, FLOTHERM US MAN VERS
[5] MAXWELL SI, 3D VERSION 4 0
[6] RODRIGUEZ E, 1999, COOLING HIGH DENSITY
[7] SIDDABATTULA K, 1999, VPEC SEM SEPT
[8] *STRUCT DYN RES CO, I DEAS MAST SER
[9] Data exchange and software integration: Interdisciplinary design challenges
Wilson, D
[J]. AI EDAM-ARTIFICIAL INTELLIGENCE FOR ENGINEERING DESIGN ANALYSIS AND MANUFACTURING, 1998, 12 (01): : 73 - 76
[10] 1994, PRODUCT MODEL DA 210

← 1 →