Surface chemistry of plasma-assisted atomic layer deposition of Al2O3 studied by infrared spectroscopy

被引:121
作者
Langereis, E. [1 ]
Keijmel, J. [1 ]
de Sanden, M. C. M. van [1 ]
Kessels, W. M. M. [1 ]
机构
[1] Eindhoven Univ Technol, Dept Appl Phys, NL-5600 MB Eindhoven, Netherlands
关键词
D O I
10.1063/1.2940598
中图分类号
O59 [应用物理学];
学科分类号
摘要
The surface groups created during plasma-assisted atomic layer deposition (ALD) of Al(2)O(3) were studied by infrared spectroscopy. For temperatures in the range of 25-150 degrees C, -CH(3) and -OH were unveiled as dominant surface groups after the Al(CH(3))(3) precursor and O(2) plasma half-cycles, respectively. At lower temperatures more -OH and C-related impurities were found to be incorporated in the Al(2)O(3) film, but the impurity level could be reduced by prolonging the plasma exposure. The results demonstrate that -OH surface groups rule the surface chemistry of the Al(2)O(3) process and likely that of plasma-assisted ALD of metal oxides from organometallic precursors in general. (C) 2008 American Institute of Physics.
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页数:3
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共 23 条
[1]   FT-IR study of water adsorption on aluminum oxide surfaces [J].
Al-Abadleh, HA ;
Grassian, VH .
LANGMUIR, 2003, 19 (02) :341-347
[2]   SURFACE-CHEMISTRY OF AL2O3 DEPOSITION USING AL(CH3)(3) AND H2O IN A BINARY REACTION SEQUENCE [J].
DILLON, AC ;
OTT, AW ;
WAY, JD ;
GEORGE, SM .
SURFACE SCIENCE, 1995, 322 (1-3) :230-242
[3]   Ozone-based atomic layer deposition of alumina from TMA: Growth, morphology, and reaction mechanism [J].
Elliott, S. D. ;
Scarel, G. ;
Wiemer, C. ;
Fanciulli, M. ;
Pavia, G. .
CHEMISTRY OF MATERIALS, 2006, 18 (16) :3764-3773
[4]   Nucleation and interface formation mechanisms in atomic layer deposition of gate oxides [J].
Frank, MM ;
Chabal, YJ ;
Wilk, GD .
APPLIED PHYSICS LETTERS, 2003, 82 (26) :4758-4760
[5]  
GOLDSTEIN DN, 2006, P 6 INT C AT LAY DEP
[6]   Low-temperature Al2O3 atomic layer deposition [J].
Groner, MD ;
Fabreguette, FH ;
Elam, JW ;
George, SM .
CHEMISTRY OF MATERIALS, 2004, 16 (04) :639-645
[7]   Influence of oxidant source on the property of atomic layer deposited Al2O3 on hydrogen-terminated Si substrate [J].
Ha, SC ;
Choi, E ;
Kim, SH ;
Roh, JS .
THIN SOLID FILMS, 2005, 476 (02) :252-257
[8]   Atomic layer deposition of Al2O3 on H-passivated Si:: Al(CH3)2OH surface reactions with H/Si(100)-2X1 -: art. no. 161302 [J].
Halls, MD ;
Raghavachari, K ;
Frank, MM ;
Chabal, YJ .
PHYSICAL REVIEW B, 2003, 68 (16)
[9]   Plasma-assisted atomic layer deposition of Ta2O5 from alkylamide precursor and remote O2 plasma [J].
Heil, S. B. S. ;
Roozeboom, F. ;
van de Sanden, M. C. M. ;
Kessels, W. M. M. .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2008, 26 (03) :472-480
[10]   In situ reaction mechanism studies of plasma-assisted atomic layer deposition of Al2O3 [J].
Heil, S. B. S. ;
Kudlacek, P. ;
Langereis, E. ;
Engeln, R. ;
van de Sanden, M. C. M. ;
Kessels, W. M. M. .
APPLIED PHYSICS LETTERS, 2006, 89 (13)