Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation

被引：150
作者：
Li, Y. S. [1 ]
Zhang, Y. [1 ]
Tao, N. R. [1 ]
Lu, K. [1 ]
机构：
[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
来源：
SCRIPTA MATERIALIA | 2008年 / 59卷 / 04期
基金：
中国国家自然科学基金;
关键词：
nanostructure; copper; annealing; mechanical properties; dynamic plastic deformation (DPD);
D O I：
10.1016/j.scriptamat.2008.04.043
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Thermal annealing of a nanostructured Cu sample processed by means of dynamic plastic deformation (DPD) induces static recrystallization (SRX) accompanied by a drop in strength and enhanced ductility. An obvious increment in tensile uniform elongation appears when the volume fraction of SRX grains exceeds 80%. The strength-ductility combination of the annealed nanostructured samples is superior to that of strain-induced ultrafine-grained Cu, owing to the finer grains and the presence of nanoscale twin bundles generated from the DPD. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：475 / 478
页数：4
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