Thermal stressing mitigation possibility intended for a DC-current magnet supply based on high power IGBT modules

被引：0

作者：

Asimakopoulos, P. ^{[1
,2
]}

Papastergiou, K. D. ^{[2
]}

Thiringer, T. ^{[1
]}

Bongiorno, M. ^{[1
]}

机构：

[1] Chalmers Univ Technol, Horsalvagen 11, Gothenburg, Sweden

[2] CERN, European Lab Particle Phys, Y03400, Geneva, Switzerland

来源：

2017 19TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'17 ECCE EUROPE) | 2017年

关键词：

Reliability; Thermal design; IGBT; Power cycling; Power supply;

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

This work investigates the possibility to reduce the thermal stressing of high power IGBT modules in a DC-current application. Using four load current profiles as examples, two mitigation strategies are presented and their benefit to the power stack in terms of lifetime prolongation is evaluated. In the final part of the work, the investigation focuses on the relation between the shape of the load current and the potential for thermal stressing limitation that the proposed mitigation strategies can provide.

引用

页数：9

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[9]

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