共 11 条
- [3] CROCKER M, 2006, Patent No. 7117931
- [4] HUANG TW, 2009, ANN M TAIW THERM MAN
- [6] Noise and cooling in electronics packages [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (03): : 535 - 542
- [7] NIWATSUKINO K, 2002, Patent No. 561226
- [8] Saini M., 2003, IEEE T COMPONENTS PA, V26
- [9] *SEM IND ASS, 2005, INT TECHN ROADM SEM, P5
- [10] Advanced micro-heat exchangers for high heat flux [J]. HEAT TRANSFER ENGINEERING, 2007, 28 (8-9) : 788 - 794