DEVELOPMENT OF A MINI LIQUID COOLING SYSTEM FOR HIGH HEAT FLUX ELECTRONIC DEVICES

被引:0
作者
Yang, Chien-Yuh [1 ]
Yeh, Chun-Ta [1 ]
Huang, Kou-Chung [1 ]
Tsai, Shao-Nong [1 ]
机构
[1] Natl Cent Univ, Dept Mech Engn, Chungli, Taiwan
来源
ICNMM 2009, PTS A-B | 2009年
关键词
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
The size of the most of the current commercialized liquid cooling systems is apparently too large to be easily adapted in a notebook or a mini size desk top computer. This study incorporated the authors' previous micro heat exchanger design with an extra slim pump concept proposed by a local manufacturer to develop a high performance miniature liquid cooling system. An integrated pump and cold plate assembly was also developed for further reducing the overall size of the system. In comparing to the commercial products, the test results show that the micro pump provides a higher maximum pressure head and maximum flow rate performance. The cold plate has the lowest thermal resistance at moderate and high flow rate region. And the performed of the entire liquid system is similar to that of the recently announced product. It is emphasized that the size of the present developed cold plate, pump and liquid cooling system is much smaller than that of all commercial products.
引用
收藏
页码:1425 / 1430
页数:6
相关论文
共 11 条
  • [1] State of the art of high heat flux cooling technologies
    Agostini, Bruno
    Fabbri, Matteo
    Park, Jung E.
    Wojtan, Leszek
    Thome, John R.
    Michel, Bruno
    [J]. HEAT TRANSFER ENGINEERING, 2007, 28 (04) : 258 - 281
  • [2] Review of cooling technologies for computer products
    Chu, RC
    Simons, RE
    Ellsworth, MJ
    Schmidt, RR
    Cozzolino, V
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2004, 4 (04) : 568 - 585
  • [3] CROCKER M, 2006, Patent No. 7117931
  • [4] HUANG TW, 2009, ANN M TAIW THERM MAN
  • [5] Recent advances in microscale pumping technologies: a review and evaluation
    Iverson, Brian D.
    Garimella, Suresh V.
    [J]. MICROFLUIDICS AND NANOFLUIDICS, 2008, 5 (02) : 145 - 174
  • [6] Noise and cooling in electronics packages
    Lyon, Richard H.
    Bergles, Arthur E.
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (03): : 535 - 542
  • [7] NIWATSUKINO K, 2002, Patent No. 561226
  • [8] Saini M., 2003, IEEE T COMPONENTS PA, V26
  • [9] *SEM IND ASS, 2005, INT TECHN ROADM SEM, P5
  • [10] Advanced micro-heat exchangers for high heat flux
    Yang, Chien-Yuh
    Yeh, Chun-Ta
    Liu, Wei-Chi
    Yang, Bing-Chwen
    [J]. HEAT TRANSFER ENGINEERING, 2007, 28 (8-9) : 788 - 794