Packaging Effect Investigation for MEMS-based Sensors WL-CSP with a Central Opening

被引：1
|
作者：
Chen, Lung-Tai [1 ]
Hsu, Yu-Wen [1 ]
Fang, Pzu-Jui [2 ]
Chen, R. S. [2 ]
机构：
[1] ITRI, Microsyst Technol Ctr, Hsinchu, Taiwan
[2] Natl Cheng Kung Univ, Dept Engn Sci, Tainan 701, Taiwan
来源：
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2010年
关键词：
FLIP-CHIP; PRESSURE; RELIABILITY; CIRCUIT; DESIGN; WLCSP;
D O I：
10.1109/ECTC.2010.5490750
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This study reports the packaging effects of wafer-level chip scale packaging (WL-CSP) with a central opening on piezoresistive pressure sensors. A regular pressure sensor with calculated sensitivity of 3.1x10(-2)mVV(-1)kPa(-1) and a sensitive pressure sensor with calculated sensitivity of 32.0x10(-2)mVV(-1)kPa(-1) are investigated. A finite element (FE) model validated by experimental measurements is used to explore the sensing characteristics of the pressure sensors. The results show that the output variation of the packaged pressure sensor is dominated by the CTE mismatch not the piezoresistive coefficient change as temperature varies. WLCSP with small polyimide (PI) thickness and large PI opening produces small packaging induced stress, making it ideal for precision sensing for both regular and sensitive pressure sensors.
引用
收藏
页码：1689 / 1695
页数：7
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