Thermal behaviour of a polyhedral oligomeric silsesquioxane with epoxy resin cured by diamines

被引：36

作者：

Ramírez, C ^{[1
]}

Abad, MJ ^{[1
]}

Barral, L ^{[1
]}

Cano, J ^{[1
]}

Díez, FJ ^{[1
]}

López, J ^{[1
]}

Montes, R ^{[1
]}

Polo, J ^{[1
]}

机构：

[1] Univ A Coruna, EUP Ferrol, Dept Fis, Ferrol 15405, Spain

来源：

JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY | 2003年 / 72卷 / 02期

关键词：

differential scanning calorimetry; epoxy systems; glycidylisobutyl-POSS; polyhedral oligomeric silsesquioxanes;

D O I：

10.1023/A:1024544709249

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

A new material belongs to the family of polyhedral oligomeric silsesquioxanes, the 1-(3-glycidyl) propoxy-3,5,7,9,11,13,15-isobutylpentacyclo-[9.5.1.1(3,9). 1( 5,15). 1(7,13)] octasiloxane (glycidylisobutyl-POSS) is characterized by differential scanning calorimetry, thermogravimetric analysis and atomic force microscopy. Epoxy systems based on diglycidyl ether of bisphenol A (DGEBA) cured with the diamines, 4,4'-diamine-diphenylmethane (DDM) and 1,4-phenylenediamine (pPDA), were kinetically studied by differential scanning calorimetry in isothermal and dynamic modes. The thermal behaviour of these systems as the glycidylisobutyl-POSS was added, is discussed later.

引用

页码：421 / 429

页数：9

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