Thermal behaviour of a polyhedral oligomeric silsesquioxane with epoxy resin cured by diamines

被引：36
作者：
Ramírez, C [1 ]
Abad, MJ [1 ]
Barral, L [1 ]
Cano, J [1 ]
Díez, FJ [1 ]
López, J [1 ]
Montes, R [1 ]
Polo, J [1 ]
机构：
[1] Univ A Coruna, EUP Ferrol, Dept Fis, Ferrol 15405, Spain
来源：
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY | 2003年 / 72卷 / 02期
关键词：
differential scanning calorimetry; epoxy systems; glycidylisobutyl-POSS; polyhedral oligomeric silsesquioxanes;
D O I：
10.1023/A:1024544709249
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
A new material belongs to the family of polyhedral oligomeric silsesquioxanes, the 1-(3-glycidyl) propoxy-3,5,7,9,11,13,15-isobutylpentacyclo-[9.5.1.1(3,9). 1( 5,15). 1(7,13)] octasiloxane (glycidylisobutyl-POSS) is characterized by differential scanning calorimetry, thermogravimetric analysis and atomic force microscopy. Epoxy systems based on diglycidyl ether of bisphenol A (DGEBA) cured with the diamines, 4,4'-diamine-diphenylmethane (DDM) and 1,4-phenylenediamine (pPDA), were kinetically studied by differential scanning calorimetry in isothermal and dynamic modes. The thermal behaviour of these systems as the glycidylisobutyl-POSS was added, is discussed later.
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页码：421 / 429
页数：9
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