Impact of Solder Paste Drying on the Solderability

被引：0

作者：

Otahal, A. ^{[1
]}

Adamek, M. ^{[1
]}

Szendiuch, I. ^{[1
]}

机构：

[1] Brno Univ Technol, Dept Microelect, CS-61090 Brno, Czech Republic

来源：

PROCEEDINGS OF THE 2014 37TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) - ADVANCES IN ELECTRONIC SYSTEM INTEGRATION | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

引用

页码：202 / 205

页数：4