Mechanical modeling of ultrasonic vibration helical grinding of SiCf/SiC composites

To reveal the mechanical characteristics of silicon carbide fiber reinforced silicon carbide ceramic matrix (SiCf/SiC) composites during the hole-making process, a mechanical model was developed and a hole-making experiment of ultrasonic vibration helical grinding (UVHG) was conducted to validate the mechanical model. To establish the model, the kinematic simulation of a single grain was carried out, which providing a theoretical basis for the selection of experimental parameters. Based on the kinematic simulation of the single grain, the contact behavior between the single grain and material was analyzed. The mechanical model considered comprehensively the force of fiber fracture, the force of matrix cracking, the force of interface wear, the force of friction, and the force of ultrasonic vibration. The results indicated that the maximum error percentage between the predicted value and the experimental value of the mechanical model is 21.1%. The high ultrasonic amplitude can effectively decrease the grinding force, as well as a low helical feed rate and a low pitch within the range of experimental parameters.