Selective silver seeding on laser modified polyimide for electroless copper plating

被引：20
作者：
Chen, DS
Li, Y
Lu, QH [1 ]
Yin, J
Zhu, ZK
机构：
[1] Shanghai Jiao Tong Univ, Sch Chem & Chem Technol, Res Inst Polymer Mat, Shanghai 200240, Peoples R China
[2] Shanghai Jiao Tong Univ, Instrumental Anal Ctr, Shanghai 200030, Peoples R China
来源：
APPLIED SURFACE SCIENCE | 2005年 / 246卷 / 1-3期
基金：
中国国家自然科学基金;
关键词：
polyimide; laser; electroless plating; silver; copper deposition;
D O I：
10.1016/j.apsusc.2004.11.005
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Copper was selectively deposited on PI surface catalyzed by laser-induced deposition of Ag particles. First, PI film was ablated by a focused Nd:YAG laser (lambda = 266 nm) for patterning, and then the ablated film was immersed in a silver diammine solution. Ag(NH3)(2)(+) ions were reduced to Ag at the ablated region on the film, and the Ag particles were deposited in situ. After rinsing the film, copper was deposited on the seeded film by electroless plating successfully. Deposits and the ablated film were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and Stylus Profiler. (c) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码：167 / 173
页数：7
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