High tensile ductility via enhanced strain hardening in ultrafine-grained Cu

被引:80
|
作者
Xue, P. [1 ]
Xiao, B. L. [1 ]
Ma, Z. Y. [1 ]
机构
[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2012年 / 532卷
基金
中国国家自然科学基金;
关键词
Copper; Grain boundaries; Ductility; Dynamic recrystallization; Friction stir processing; MECHANICAL-BEHAVIOR; FRICTION; NANOCRYSTALLINE; STRENGTH; METALS;
D O I
10.1016/j.msea.2011.10.070
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Low tensile ductility owing to the insufficient strain hardening is the main drawback for ultrafine-grained (UFG) materials, which restricts their practical applications. Here, via a simple friction stir processing technique with additional cooling, we prepared UFG Cu with high strength and tensile ductility. Enhanced strain hardening capacity, which is effective in blocking and accumulating dislocations, was achieved in the present recrystallized UFG microstructure. The enhanced strain hardening capacity is attributed primarily to the low dislocation density, and the presence of large fraction of high angle grain boundaries and a certain amount of coherent twin boundaries. This work provides a strategy for designing UFG materials with good mechanical properties. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:106 / 110
页数:5
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