SiC Integrated Circuit Control Electronics for High-Temperature Operation

被引:54
|
作者
Alexandru, Mihaela [1 ]
Banu, Viorel [2 ]
Jorda, Xavier [2 ]
Montserrat, Josep [2 ]
Vellvehi, Miquel [2 ]
Tournier, Dominique [1 ]
Millan, Jose [2 ]
Godignon, Philippe [2 ]
机构
[1] IMB CNM Barcelona, Barcelona 08193, Spain
[2] Natl Ctr Microelect Barcelona IMB CNM CSIC, Barcelona 08193, Spain
关键词
Digital integrated circuits (ICs); driver; high density; high power; high temperature; integrated circuits; MESFET; mixed signal; silicon carbide (SiC); voltage reference;
D O I
10.1109/TIE.2014.2379212
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This paper is an important step toward the development of complex integrated circuit (IC) control electronics that have to attend to high-temperature environment power applications. We present in premiere a prototype set of essential mixed-signal ICs on SiC capable of controlling power switches and a lateral power MESFET able to operate at high temperatures, all embedded on the same chip. Also, we report for the first time the functionality of standard Si-CMOS topologies on SiC for the master-slave data flip-flop (FF) and data-reset FF digital building blocks designed with MESFETs. Concretely, we present the complete development of SiC-MESFET IC circuitry, able to integrate gate drivers for SiC power devices. This development is based on the mature and stable Tungsten-Schottky interface technology used for the fabrication of stable SiC Schottky diodes for the European Space Agency Mission BepiColombo.
引用
收藏
页码:3182 / 3191
页数:10
相关论文
共 50 条
  • [21] SOI-Based Integrated Circuits for High-Temperature Power Electronics Applications
    Greenwell, R. L.
    McCue, B. M.
    Zuo, L.
    Huque, M. A.
    Tolbert, L. M.
    Blalock, B. J.
    Islam, S. K.
    2011 TWENTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2011, : 836 - 843
  • [22] High-Temperature Nanoindentation of SiC/SiC Composites
    Frazer, D.
    Deck, C. P.
    Hosemann, P.
    JOM, 2020, 72 (01) : 139 - 144
  • [23] High-Temperature Nanoindentation of SiC/SiC Composites
    D. Frazer
    C. P. Deck
    P. Hosemann
    JOM, 2020, 72 : 139 - 144
  • [24] Materials for high-temperature digital electronics
    Pradhan, Dhiren K.
    Moore, David C.
    Francis, A. Matt
    Kupernik, Jacob
    Kennedy, W. Joshua
    Glavin, Nicholas R.
    Olsson III, Roy H.
    Jariwala, Deep
    NATURE REVIEWS MATERIALS, 2024, 9 (11): : 790 - 807
  • [25] Rise of flexible high-temperature electronics
    Yun-Lei Zhou
    Wen-Na Cheng
    Yun-Zhao Bai
    Chao Hou
    Kan Li
    Yong-An Huang
    Rare Metals, 2023, 42 : 1773 - 1777
  • [26] Rise of flexible high-temperature electronics
    Yun-Lei Zhou
    Wen-Na Cheng
    Yun-Zhao Bai
    Chao Hou
    Kan Li
    Yong-An Huang
    RareMetals, 2023, 42 (06) : 1773 - 1777
  • [27] Rise of flexible high-temperature electronics
    Zhou, Yun-Lei
    Cheng, Wen-Na
    Bai, Yun-Zhao
    Hou, Chao
    Li, Kan
    Huang, Yong-An
    RARE METALS, 2023, 42 (06) : 1773 - 1777
  • [28] SPECIAL ISSUE ON HIGH-TEMPERATURE ELECTRONICS
    IRWIN, JD
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 1982, 29 (02) : 101 - 101
  • [29] An Integrated SiC Photo-Transistor for Ultraviolet Detection in High-Temperature Environments
    Holmes, Jim
    Francis, A. Matt
    Chiolino, Nicholas
    Barlow, Matthew
    Perez, Sonia
    Getreu, Ian
    2019 IEEE SENSORS APPLICATIONS SYMPOSIUM (SAS), 2019,
  • [30] A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit
    Yao, Zong
    Liang, Ting
    Jia, Pinggang
    Hong, Yingping
    Qi, Lei
    Lei, Cheng
    Zhang, Bin
    Xiong, Jijun
    SENSORS, 2016, 16 (06):