SiC Integrated Circuit Control Electronics for High-Temperature Operation

被引:54
|
作者
Alexandru, Mihaela [1 ]
Banu, Viorel [2 ]
Jorda, Xavier [2 ]
Montserrat, Josep [2 ]
Vellvehi, Miquel [2 ]
Tournier, Dominique [1 ]
Millan, Jose [2 ]
Godignon, Philippe [2 ]
机构
[1] IMB CNM Barcelona, Barcelona 08193, Spain
[2] Natl Ctr Microelect Barcelona IMB CNM CSIC, Barcelona 08193, Spain
关键词
Digital integrated circuits (ICs); driver; high density; high power; high temperature; integrated circuits; MESFET; mixed signal; silicon carbide (SiC); voltage reference;
D O I
10.1109/TIE.2014.2379212
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This paper is an important step toward the development of complex integrated circuit (IC) control electronics that have to attend to high-temperature environment power applications. We present in premiere a prototype set of essential mixed-signal ICs on SiC capable of controlling power switches and a lateral power MESFET able to operate at high temperatures, all embedded on the same chip. Also, we report for the first time the functionality of standard Si-CMOS topologies on SiC for the master-slave data flip-flop (FF) and data-reset FF digital building blocks designed with MESFETs. Concretely, we present the complete development of SiC-MESFET IC circuitry, able to integrate gate drivers for SiC power devices. This development is based on the mature and stable Tungsten-Schottky interface technology used for the fabrication of stable SiC Schottky diodes for the European Space Agency Mission BepiColombo.
引用
收藏
页码:3182 / 3191
页数:10
相关论文
共 50 条
  • [1] SiC JMOSFETs for high-temperature stable circuit operation
    Koo, SM
    Zetterling, CM
    Lee, HS
    Ostling, M
    SILICON CARBIDE AND RELATED MATERIALS 2003, PTS 1 AND 2, 2004, 457-460 : 1445 - 1448
  • [2] SIC FOR SENSORS AND HIGH-TEMPERATURE ELECTRONICS
    MULLER, G
    KROTZ, G
    SENSORS AND ACTUATORS A-PHYSICAL, 1994, 43 (1-3) : 259 - 268
  • [3] High-temperature operation of SiC planar ACCUFET
    Chilukuri, RK
    Shenoy, PM
    Baliga, BJ
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 1999, 35 (06) : 1458 - 1462
  • [4] High-temperature operation of SiC planar ACCUFET
    North Carolina State Univ, Raleigh, United States
    IEEE Trans Ind Appl, 6 (1458-1462):
  • [5] High-Temperature SiC Power Module with Integrated SiC Gate Drivers for Future High-Density Power Electronics Applications
    Whitaker, Bret
    Cole, Zach
    Passmore, Brandon
    Martin, Daniel
    McNutt, Ty
    Lostetter, Alex
    Ericson, M. Nance
    Frank, S. Shane
    Britton, Charles L.
    Marlino, Laura D.
    Mantooth, Alan
    Francis, Matt
    Lamichhane, Ranj An
    Shepherd, Paul
    Glover, Michael
    2014 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2014, : 36 - 40
  • [6] Combination of JFET and MOSFET devices in 4H-SiC for high-temperature stable circuit operation
    Koo, SM
    Zetterling, CM
    Lee, HS
    Östling, M
    ELECTRONICS LETTERS, 2003, 39 (12) : 933 - 935
  • [7] Design and Operation of an Integrated High-Temperature Measurement Structure
    Boianceanu, Cristian
    Simon, Dan Ionut
    Costachescu, Dragos
    Pfost, Martin
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2012, 25 (04) : 542 - 548
  • [8] High-temperature operation of oxide SFQ-circuit-elements
    Tsubone, K
    Wakana, H
    Ishimaru, Y
    Adachi, S
    Nakayama, K
    Tarutani, Y
    Tanabe, K
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2005, 15 (04) : 3911 - 3916
  • [9] High-Temperature High-Power Operation of a 100 A SiC DMOSFET Module
    Salem, T. E.
    Urciuoli, D. P.
    Green, R.
    Ovrebo, G. K.
    APEC: 2009 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1- 4, 2009, : 653 - +
  • [10] EXTENSION OF HIGH-TEMPERATURE ELECTRONICS
    DRAPER, BL
    PALMER, DW
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (04): : 399 - 404