Analysis of thermal expansion in elastic and elastoplastic layers subjected to cyclic thermal loading

被引：7

作者：

Wada, K. ^{[1
]}

Yagi, Y.

Nakagawa, I. ^{[2
]}

Atsumi, T. ^{[2
]}

Ohno, N. ^{[3
]}

机构：

[1] Toyota Cent Res & Dev Labs Inc, Inorgan Mat Lab, Aichi 4801192, Japan

[2] Toyota Motor Co Ltd, Aichi 4718572, Japan

[3] Nagoya Univ, Dept Computat Sci & Engn, Chikusa Ku, Nagoya, Aichi 4648603, Japan

来源：

MICROELECTRONICS RELIABILITY | 2010年 / 50卷 / 9-11期

关键词：

STRESS-STRAIN CURVES; PLASTICITY; COPPER;

D O I：

10.1016/j.microrel.2010.07.012

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thermal expansion of a Cu/Si3N4/Cu layered structure was studied by actual measurement and finite element analysis. Thicker Cu and subjecting the samples to cyclic thermal loading increase the thermal expansion of the layered structure. Strain-controlled cyclic tension/compression tests in Cu were performed to obtain the characteristics of cyclic plasticity. A multi-linear kinematic hardening model was applied to represent the elastoplasticity of Cu. Two sets of material parameters were determined: One set from the initial and a second set from the stabilized stress-strain relationship, respectively. It was demonstrated that the determined material parameters allow accurate prediction of the thermal expansion coefficient within 1 ppm/degrees C for structures subjected and non-subjected to cyclic thermal loading. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：1626 / 1630

页数：5

共 27 条

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