Fabrication of silicon molds for polymer optics

被引:55
|
作者
Nilsson, D [1 ]
Jensen, S [1 ]
Menon, A [1 ]
机构
[1] Tech Univ Denmark, Mikroelekt Ctr, DK-2800 Lyngby, Denmark
关键词
D O I
10.1088/0960-1317/13/4/309
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A silicon mold used for structuring polymer microcavities for optical applications is fabricated, using a combination of DRIE (deep reactive ion etching) and anisotropic chemical wet etching with KOH + IPA. For polymer optical microcavities, low surface roughness and vertical sidewalls are often needed. This is achieved by aligning the mold precisely to the [110] direction of a silicon (100) wafer and etching very close to the (110) surfaces using a DRIE Bosch process. The surface roughness of the sidewalls is then removed with a short etch in KOH + IPA. To achieve this, the parameters for DRIE and KOH + IPA etch have been optimized. To reduce stiction between the silicon mold and the polymers used for molding, the mold is coated with a teflon-like material using the DRIE system. Released polymer microstructures characterized with AFM and SEM are also presented.
引用
收藏
页码:S57 / S61
页数:5
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