A thermosyphon heat pipe cooler for high power LEDs cooling

被引：24

作者：

Li, Ji ^{[1
]}

Tian, Wenkai ^{[1
]}

Lv, Lucang ^{[1
]}

机构：

[1] Univ Chinese Acad Sci, Coll Phys, Lab Adv Thermal Management Technol, 19A Yu Quan Lu Rd, Beijing 100049, Peoples R China

来源：

HEAT AND MASS TRANSFER | 2016年 / 52卷 / 08期

基金：

中国国家自然科学基金;

关键词：

2-PHASE CLOSED THERMOSIPHON;

D O I：

10.1007/s00231-015-1679-z

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Light emitting diode (LED) cooling is facing the challenge of high heat flux more seriously with the increase of input power and diode density. The proposed unique thermosyphon heat pipe heat sink is particularly suitable for cooling of high power density LED chips and other electronics, which has a heat dissipation potential of up to 280 W within an area of 20 mm x 22 mm (> 60 W/cm(2)) under natural air convection. Meanwhile, a thorough visualization investigation was carried out to explore the two phase flow characteristics in the proposed thermosyphon heat pipe. Implementing this novel thermosyphon heat pipe heat sink in the cooling of a commercial 100 W LED integrated chip, a very low apparent thermal resistance of 0.34 K/W was obtained under natural air convection with the aid of the enhanced boiling heat transfer at the evaporation side and the enhanced natural air convection at the condensation side.

引用

页码：1541 / 1548

页数：8

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