Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder

被引：18
作者：
Yang, Li [1 ,2 ]
Ge, Jinguo [1 ,3 ]
Zhang, Yaocheng [1 ]
Dai, Jun [1 ]
Jing, Yanfeng [1 ,3 ]
机构：
[1] Changshu Inst Technol, Sch Mech Engn, Changshu 215500, Jiangsu, Peoples R China
[2] Xuzhou Inst Technol, Jiangsu Key Lab Large Engn Equipment Detect & Con, Xuzhou 221008, Jiangsu, Peoples R China
[3] China Univ Min & Technol, Sch Mat Sci & Engn, Xuzhou 221008, Jiangsu, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2015年 / 26卷 / 01期
基金：
中国国家自然科学基金;
关键词：
ADDITIONS; JOINTS; BEHAVIOR; GROWTH; NI; SB;
D O I：
10.1007/s10854-014-2443-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Minor weight fraction of the BaTiO3 particle is doped into the Sn1.0Ag0.5Cu (SAC) lead-free solder by the mechanically mixing. The effect of BaTiO3 on the microstructure and mechanical properties of the SAC lead-free solder is investigated. The results show that the beta-Sn is refined and the volume fraction of the eutectic phase is increased by adding BaTiO3. The beta-Sn morphology is transformed from the block into the lamellar in the SAC + 0.2 wt% BaTiO3, and a Cu6Sn5 IMC layer with thickness of about 7.3 mu m is obtained. The optimal spreadability of the SAC-0.2BaTiO(3) is obtained, and the spreading coefficient reaches 0.7836, it is 23.48 % higher than that of the SAC solder. The ultimate tensile strength and the elongation are improved by the BaTiO3 addition. The fracture surface of the SAC-0.2BaTiO(3) solder specimen consists of large amounts of dimples due to the highly ductile manner.
引用
收藏
页码：613 / 619
页数：7
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