Modeling of a polishing tool to simulate material removal

被引:13
作者
Guiot, Anthony [1 ]
Pattofatto, Stephane [2 ]
Tournier, Christophe [1 ]
Mathieu, Luc [1 ]
机构
[1] Univ Paris 11, LURPA, ENS Cachan, 61 Av Pdt Wilson, F-94230 Cachan, France
[2] Univ Paris 06, LMT Cachan, ENS Cachan, F-94230 Cachan, France
来源
MODELLING OF MACHINING OPERATIONS | 2011年 / 223卷
关键词
Polishing; Material Removal Rate; Tool wear; Numerical simulation; Form deviation;
D O I
10.4028/www.scientific.net/AMR.223.754
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In plastic injection mould and prosthesis industries, 'mirror-effect' polished surfaces are required for obtaining transparent parts or surfaces without scratches. Traditionally done manually, we have proposed to automate polishing on 5-axis machining centre using a passive elastomeric carrier. One of the main advantages of automatic polishing is the repeatability of the machine movements in order to achieve restricted form deviations. However, the material removal rate (MRR) during polishing depends on parameters such as contact pressure, relative velocity and tool wear. We have thus developed a model dedicated to our process to compute the effective MRR along the polishing tool path regarding the contact area and the contact pressure between the tool and the part.
引用
收藏
页码:754 / +
页数:2
相关论文
共 12 条
[1]   A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale [J].
Bai, J. ;
Zhao, Y. W. ;
Wang, Y. G. .
APPLIED SURFACE SCIENCE, 2007, 253 (20) :8489-8494
[2]   A chemical mechanical polishing model based on the viscous flow of the amorphous layer [J].
Jiang, Jian-Zhong ;
Zhao, Yong-Wu ;
Wang, Yong-Guang ;
Luo, Jian-Bin .
WEAR, 2008, 265 (7-8) :992-998
[3]   Kinematical performance prediction in multi-axis machining for process planning optimization [J].
Lavernhe, Sylvain ;
Tournier, Christophe ;
Lartigue, Claire .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2008, 37 (5-6) :534-544
[4]   Modification of the Preston equation for the chemical-mechanical polishing of copper [J].
Luo, Q ;
Ramarajan, S ;
Babu, SV .
THIN SOLID FILMS, 1998, 335 (1-2) :160-167
[5]  
Mizugaki Y., 1992, CIRP Ann. - Manuf. Technol, V41, P531, DOI [10.1016/S0007-8506(07)61261-X, DOI 10.1016/S0007-8506(07)61261-X]
[6]   A PROCESS MODEL FOR ROBOTIC DISC GRINDING [J].
NASRI, H ;
BOLMSJO, G .
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 1995, 35 (04) :503-510
[7]   An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes [J].
Oh, Seunghee ;
Seok, Jongwon .
WEAR, 2009, 266 (7-8) :839-849
[8]   Automatic polishing process of plastic injection molds on a 5-axis milling center [J].
Pessoles, Xavier ;
Tournier, Christophe .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2009, 209 (07) :3665-3673
[9]  
Preston F.W., 1927, J SOC GLASS TECHNOLO, V11, P214
[10]   Robotic polishing of free-form surfaces using scanning paths [J].
Tam, HY ;
Lui, OCH ;
Mok, ACK .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1999, 95 (1-3) :191-200