Polyimide-matrix-based composite materials

被引：10

作者：

Danev, G ^{[1
]}

Assa, J ^{[1
]}

Jivkov, I ^{[1
]}

Strijkova, V ^{[1
]}

Spassova, E ^{[1
]}

机构：

[1] Bulgarian Acad Sci, Cent Lab Photoproc, BU-1113 Sofia, Bulgaria

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2003年 / 14卷 / 10-12期

关键词：

D O I：

10.1023/A:1026186127962

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A polycondensation solid-state-reaction-based polyimide (PI) matrix has been used for composite material formation. Two types of PI matrix have been employed - a bulk PI system prepared by pressing a mixture of the powdered precursors (4, 4'-oxidianiline (ODA) and pyromellitic dianhydride (PMDA)) and a thin-film matrix formed by vapor co-deposition of the same precursors, PI monomers. A variety of different "guests" (trimethylaminalan, phthalocyanine, carbon) and the methods for their incorporation into the PI matrix are presented. The influence of the "guest" concentration and the thermal-treatment conditions on the surface morphology are shown and discussed. (C) 2003 Kluwer Academic Publishers.

引用

页码：825 / 827

页数：3

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