Influence of surface modification of alumina on bond strength in Al2O3/Al/Al2O3 joints

被引:8
作者
Ksiazek, M
Sobczak, N
Mikulowski, B
Radziwill, W
Winiarski, B
Wojcik, M
机构
[1] Foundry Res Inst, PL-30418 Krakow, Poland
[2] AGH Univ Sci & Technol, PL-30059 Krakow, Poland
关键词
D O I
10.1007/s10853-005-1984-x
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The subject of the work was to study the effect of Ti thin film on alumina ceramic on mechanical strength and fracture character of Al2O3/Al/Al2O3 joints. The joints were formed by liquid state bonding of alumina substrates covered with titanium thin film of 800 nm thickness using Al interlayer of 30 mu m thickness at temperature of 973 K in a vacuum of 0.2 mPa for 5 min. The bend strength was measured by four-point bending test at room temperature. Scanning and transmission electron microscopy were applied for detailed characterization of interface structure and failure character of fractured joint surfaces. Result analysis has shown that application of the Ti thin film on alumina leads to decrease of bond strength properties of Al2O3/Al/Al2O3 joints along with the change either of structure and chemistry of interface or of failure character. (C) 2005 Springer Science + Business Media, Inc.
引用
收藏
页码:2513 / 2517
页数:5
相关论文
共 12 条
[1]   INTERFACE FORMATION AND STRENGTH IN CERAMIC-METAL SYSTEMS [J].
DALGLEISH, BJ ;
SAIZ, E ;
TOMSIA, AP ;
CANNON, RM ;
RITCHIE, RO .
SCRIPTA METALLURGICA ET MATERIALIA, 1994, 31 (08) :1109-1114
[2]   ON THE DECOHESION OF RESIDUALLY STRESSED THIN-FILMS [J].
DRORY, MD ;
THOULESS, MD ;
EVANS, AG .
ACTA METALLURGICA, 1988, 36 (08) :2019-2028
[3]   THE FRACTURE-RESISTANCE OF METAL-CERAMIC INTERFACES [J].
EVANS, AG ;
DALGLEISH, BJ .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1993, 162 (1-2) :1-13
[4]  
KSIAZEK M, 2002, P JOIN ADV SPEC MAT, P96
[5]  
Ksiazek M., 2001, T JWRI, V30, P119
[6]   Joining of alumina via copper/niobium/copper interlayers [J].
Marks, RA ;
Chapman, DR ;
Danielson, DT ;
Glaeser, AM .
ACTA MATERIALIA, 2000, 48 (18-19) :4425-4438
[7]   ELECTRONIC-STRUCTURE AND CHEMICAL-REACTIONS AT METAL ALUMINA AND METAL ALUMINUM NITRIDE INTERFACES [J].
OHUCHI, FS ;
KOHYAMA, M .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1991, 74 (06) :1163-1187
[8]   Bridging stresses and R-curves in ceramic/metal composites [J].
Raddatz, O ;
Schneider, GA ;
Mackens, W ;
Voss, H ;
Claussen, N .
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2000, 20 (13) :2261-2273
[9]   MECHANICS AND MECHANISMS OF CRACK-GROWTH AT OR NEAR CERAMIC-METAL INTERFACES - INTERFACE ENGINEERING STRATEGIES FOR PROMOTING TOUGHNESS [J].
RITCHIE, RO ;
CANNON, RM ;
DALGLEISH, BJ ;
DAUSKARDT, RH ;
MCNANEY, JM .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1993, 166 (1-2) :221-235
[10]   The effect of temperature, matrix alloying and substrate coatings on wettability and shear strength of Al/Al2O3 couples [J].
Sobczak, N ;
Asthana, R ;
Ksiazek, M ;
Radziwill, W ;
Mikulowski, B .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2004, 35A (03) :911-923