Effects of hydrogen on positive charges in gate oxides

被引:38
作者
Zhao, CZ [1 ]
Zhang, JF [1 ]
机构
[1] Liverpool John Moores Univ, Sch Engn, Liverpool L3 3AF, Merseyside, England
基金
英国工程与自然科学研究理事会;
关键词
D O I
10.1063/1.1882771
中图分类号
O59 [应用物理学];
学科分类号
摘要
Positive charge formation in gate oxides is a main source for the instability of the state-of-the-art metal-oxide-semiconductor device. Despite past efforts, the relation between hydrogenous species and positive charges is not fully understood. In this work, the effects of hydrogen on positive charges will be investigated at both elevated temperature (e.g., 400 degrees C) and room temperature. At 400 degrees C, it is found that hydrogen can convert some defects into hole traps. Three different types of positive charges have been reported recently. They are as-grown hole traps, anti-neutralization positive charges (ANPC), and cyclic positive charges (CPC). Although an exposure to hydrogen at 400 degrees C neutralizes all three, impacts of hydrogen on these three types of defects are markedly different. After the hydrogen-induced neutralization, the defect responsible for ANPC is fully recovered and is the same as that in a fresh device. In contrast, the defect for CPC is not fully recovered and can be reactivated easily by stresses. The as-grown hole trap can be converted to ANPC through hydrogenation. At room temperature, it will be shown that there are two parallel processes for forming positive charges. One involves hydrogen and the other is through hole trapping. The relative importance of these two depends on the relative density of hydrogen against that of holes. (C) 2005 American Institute of Physics.
引用
收藏
页数:8
相关论文
共 34 条
[1]   CURRENT UNDERSTANDING OF CHARGES IN THERMALLY OXIDIZED SILICON STRUCTURE [J].
DEAL, BE .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (06) :C198-C205
[2]   Stress polarity dependence of degradation and breakdown of SiO2/high-k stacks [J].
Degraeve, R ;
Kauerauf, T ;
Kerber, A ;
Cartier, E ;
Govoreanu, B ;
Roussel, P ;
Pantisano, L ;
Blomme, P ;
Kaczer, B ;
Groeseneken, G .
41ST ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2003, :23-28
[3]  
DiMaria D.J., 1978, PHYSICS SIO2 ITS INT, P160
[4]   Anode hole injection, defect generation, and breakdown in ultrathin silicon dioxide films [J].
DiMaria, DJ ;
Stathis, JH .
JOURNAL OF APPLIED PHYSICS, 2001, 89 (09) :5015-5024
[5]   Effects of hydrogen transport and reactions on microelectronics radiation response and reliability [J].
Fleetwood, DM .
MICROELECTRONICS RELIABILITY, 2002, 42 (4-5) :523-541
[6]   Anode hole generation mechanisms [J].
Ghetti, A ;
Alam, M ;
Bude, J .
MICROELECTRONICS RELIABILITY, 2001, 41 (9-10) :1347-1354
[7]   HIGH-FIELD ELECTRONIC PROPERTIES OF SIO2 [J].
HUGHES, RC .
SOLID-STATE ELECTRONICS, 1978, 21 (01) :251-258
[8]   HOLE TRAPS AND TRIVALENT SILICON CENTERS IN METAL-OXIDE SILICON DEVICES [J].
LENAHAN, PM ;
DRESSENDORFER, PV .
JOURNAL OF APPLIED PHYSICS, 1984, 55 (10) :3495-3499
[9]   CAPTURE CROSS-SECTION AND TRAP CONCENTRATION OF HOLES IN SILICON DIOXIDE [J].
NING, TH .
JOURNAL OF APPLIED PHYSICS, 1976, 47 (03) :1079-1081
[10]   NEW MODEL OF A COMMON ORIGIN FOR TRAPPED HOLES AND ANOMALOUS POSITIVE CHARGE IN MOS CAPACITORS [J].
ROH, Y ;
TROMBETTA, L ;
STATHIS, J .
MICROELECTRONIC ENGINEERING, 1993, 22 (1-4) :227-230