Void Formation during Diffusion - Two-Dimensional Approach

被引：1
|
作者：
Wierzba, Bartek [1 ]
机构：
[1] Rzeszow Univ Technol, Fac Mech Engn & Aeronaut, Al Powstancow Warszawy 12, PL-35959 Rzeszow, Poland
来源：
HIGH TEMPERATURE MATERIALS AND PROCESSES | 2016年 / 35卷 / 06期
关键词：
diffusion; Frenkel effect; backstress; COMPETITION;
D O I：
10.1515/htmp-2015-0049
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The final set of equations defining the interdiffusion process in solid state is presented. The model is supplemented by vacancy evolution equation. The competition between the Kirkendall shift, backstress effect and vacancy migration is considered. The proper diffusion flux based on the Nernst-Planck formula is proposed. As a result, the comparison of the experimental and calculated evolution of the void formation in the Fe-Pd diffusion couple is shown.
引用
收藏
页码：629 / 633
页数：5
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