Micromachining technology for lateral field emission devices

被引：26

作者：

Milanovic, V ^{[1
]}

Doherty, L

Teasdale, DA

Parsa, S

Pister, KSJ

机构：

[1] La Jolla Microsyst Inst, San Diego, CA 92110 USA

[2] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA

[3] Univ Calif Berkeley, UC Berkeley Microfabricat Lab, Berkeley, CA 94720 USA

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 2001年 / 48卷 / 01期

关键词：

deep reactive ion etch; field emission device; MEMS; micromachining; vacuum microelectronics; vacuum tubes;

D O I：

10.1109/16.892185

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We demonstrate a range of novel applications of micromachining and microelectromechanical systems (MEMS) for achieving efficient and tunable field emission devices (FEDs), Arrays of lateral field emission tips are fabricated with submicron spacing utilizing deep reactive ion etch (DRIE), Current densities above 150 A/cm(2) are achieved with over 150 . 10(6) tips/cm(2). With sacrificial sidewall spacing, electrodes can be placed at arbitrarily close distances to reduce turn-on voltages. F-Ve further utilize MEMS actuators to laterally adjust electrode distances. To improve the integration capability of FEDs, we demonstrate batch hump-transfer of working lateral FEDs onto a quartz target substrate.

引用

页码：166 / 173

页数：8

共 50 条

[31] RELIABLE CARBON NANOTUBE BASED MICRO WIRE FOR MICRO FOCUS FIELD EMISSION X-RAY SOURCE BY MICROMACHINING
Sun, Bin
Wang, Yan
Deng, Min
Ding, Guifu
[J]. 2017 19TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2017, : 1967 - 1970
[32] Bulk micromachining characterization of 0.2 μm HEMT MMIC technology for GaAs MEMS design
Ribas, RP
Leclercq, JL
Karam, JM
Courtois, B
Viktorovitch, P
[J]. MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1998, 51 (1-3): : 267 - 273
[33] Fabrication and characterization of the Pd-silicided emitters for field-emission devices
Wang, CC
Ku, TK
Hsieh, IJ
Cheng, HC
[J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (6A): : 3681 - 3685
[34] A novel sub-micron gap fabrication technology using chemical-mechanical polishing (CMP): application to lateral field emission device (FED)
Lee, CS
Han, CH
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2002, 97-8 : 739 - 743
[35] Fabrication of Large-Area Field Emission Arrays by Bonding Technology
黄庆安
向涛
秦明
陈军宁
张会珍
童勤义
[J]. Chinese Science Bulletin, 1993, (22) : 1866 - 1869
[36] Strength Differences of Lateral, Top and Bottom Surface in Monocrystalline Silicon Micromachining
Cozzi, Sara
Martini, Roberto
Coppo, Francesco
Langfelder, Giacomo
Belloni, Edoardo
Dellea, Stefano
Coronato, Luca
[J]. 2024 IEEE INTERNATIONAL SYMPOSIUM ON INERTIAL SENSORS AND SYSTEMS, INERTIAL, 2024,
[37] Silicon micromachining techniques as a tool to fabricate channeling-based devices
Antonini, A.
Butturi, M.
Guidi, V.
Martinelli, G.
Mazzolari, A.
Milan, E.
[J]. INTERNATIONAL CONFERENCE ON CHARGED AND NEUTRAL PARTICLES CHANNELING PHENOMENA II - CHANNELING 2006, 2007, 6634
[38] An excimer laser micromachining system for the production of bioparticle electromanipulation devices.
Rizvi, NH
Harvey, EC
Rumsby, PT
Burt, JPH
Talary, MS
Tame, JA
Pethig, R
[J]. MICROMACHINED DEVICES AND COMPONENTS III, 1997, 3224 : 266 - 272
[39] Flexure-beam micromirror devices and potential expansion for smart micromachining
Lin, TH
[J]. SMART STRUCTURES AND MATERIALS 1996: SMART ELECTRONICS AND MEMS, 1996, 2722 : 20 - 29
[40] Advanced micromachining processes for micro-opto-electromechanical components and devices
D'Arrigo, G
Coffa, S
Spinella, C
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 2002, 99 (1-2) : 112 - 118

← 1 2 3 4 5 →