Optimal material-removal-ratio parameters in multi-wire sawing process by fractal geometry

被引:0
作者
Wu, Sung-Hua [1 ]
机构
[1] Natl Kaohsiung First Univ Sci & Technol, Dept Mech & Automat Engn, Kaohsiung, Taiwan
来源
NEW TRENDS ON SYSTEM SCIENCES AND ENGINEERING | 2015年 / 276卷
关键词
high-speed sawing process; chip load; KRCL; MMR; differential analytic-geometry method;
D O I
10.3233/978-1-61499-522-7-459
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
Factors of affecting the saw blade life are included process error and precision control. Process errors are contained the design of cutting tooth geometry, banding angle, tool surface coating and tool rigidity; precision includes the vibration of machine tool, cutting mechanism and the workpiece properties. Unsuitable set-up of the above factors will result in preferentially failure and wear for the tool life. In this study, importing the dynamic random factors and the conditions of fractal geometry, can be extended from the cutting quasi-static system to high-speed dynamic-random cutting system (Kinematic-Radom Chip load, KRCL). On the other hand, in which given tool geometry conditions and environmental parameters set-up, can be optimized as the maximum material removal rate (MMR) by differential analytical-geometry (differential analytic-geometry method). According to the results of simulation, the undeformed chip distribution was Gaussian characteristics distribution for most sections of entire cutters, but the largest damaged occurred on the sinusoidal-wave non-exact boundary for sawing process. For adjusting the process parameters by fractal geometry, the optimal parameters can be used on unit wave pitch 6mm, cutters numbers of unit wave 5, tangential force 100N, vertical force 300N, cutting force 200N, cutter width for tool geometry 0.8mm, and removal depth for the first cutter 0.15mm for sawing mechanism 2-DOF, and the maximum removal-material ratio 4.5mm/s for unit pitch in machining process.
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页码:459 / 469
页数:11
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