Some aspects of nucleation and growth in Pb free Sn-Ag-Cu solder

被引:25
作者
Snugovsky, L
Snugovsky, P
Perovic, DD
Sack, T
Rutter, JW
机构
[1] Univ Toronto, Dept Mat Sci & Engn, Ctr Microelect Assembly & Packaging, Toronto, ON M5S 3E4, Canada
[2] Celestica Inc, Toronto, ON, Canada
关键词
Sn-Ag-Cu alloy; nucleation; crystal growth; microstucture;
D O I
10.1179/174328405X13994
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
To investigate the minimum superheat necessary to solder components on printed circuit boards successfully using 95.5 wt-%Sn, 3.8 wt-%Ag, 0.7 wt-%Cu solder, experiments were carried out using separate solder balls of the type used in ball grid arrays. Significant differences in microstructure were observed depending on the peak temperature reached in the liquid on melting. On cooling, substantial undercooling was often observed, with values up to 18 K. Under some freezing conditions, the primary phase formed was Ag3Sn, while under other conditions the primary phase was Sn. The amount and type of eutectic microstructure formed was observed to vary with freezing conditions. The types of microstructure formed are illustrated. Nucleation phenomena and their effect on subsequent growth are discussed.
引用
收藏
页码:53 / 60
页数:8
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