Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry

被引：13

作者：

Bittrich, Eva ^{[1
]}

Windrich, Frank ^{[2
,3
]}

Martens, Dominik ^{[1
,4
]}

Bittrich, Lars ^{[1
]}

Haeussler, Liane ^{[1
]}

Eichhorn, Klaus-Jochen ^{[1
]}

机构：

[1] Leibniz Inst Polymerforsch Dresden eV, Dresden, Germany

[2] Fraunhofer IZM, Ctr All Silicon Syst Integrat Dresden, Moritzburg, Germany

[3] Tech Univ Dresden, Organ Chem Polymers, Dresden, Germany

[4] New Mexico State Univ, Las Cruces, NM 88003 USA

来源：

POLYMER TESTING | 2017年 / 64卷

关键词：

Glass transition; Polyimide; Thin film; Spectroscopic ellipsometry; POLYSTYRENE;

D O I：

10.1016/j.polymertesting.2017.09.030

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

We characterized the glass transition temperature T-g of thin polyimide films by temperature-dependent spectroscopic ellipsometry and compared the results to DSC measurements of the bulk polymer. The effect of the curing temperature on T-g and the thermal expansion alpha(T) was analyzed. An improved ellipsometric data evaluation was used to get most precise and reliable T-g data. T-g increased with increasing curing temperature, while the bulk T-g was considerably lower than the thin film T-g. Both observations are attributed to the temperature sensitive release of the imidization by-product 2-hydroxyethyl methacrylate (HEMA) and crosslinker components as well as decomposition products from the material. Variation in the curing temperatures of 230-380 degrees C led to an increase in the T-g of 34 degrees C. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：48 / 54

页数：7

共 14 条

[1] Reduced Glass Transition Temperatures in Thin Polymer Films: Surface Effect or Artifact? [J].