A Thermal Network Model of a Printed Circuit Board Considering the Thermal Contraction Flow Caused by Thermal Vias

被引：0

作者：

Honda, Masato ^{[1
]}

Hatakeyama, Tomoyuki ^{[1
]}

Nakagawa, Shinji ^{[1
]}

Kibushi, Risako ^{[1
]}

Ishizuka, Masaru ^{[1
]}

机构：

[1] Toyama Prefectural Univ, Dept Mech Syst Engn, 5180 Kurokawa, Imizu, Toyama 9390358, Japan

来源：

2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022) | 2022年

关键词：

Thermal management; Electronics device; Effective thermal conductivity; Thermal construction;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

As the heat generation density of electronic devices increases, thermal vias are inserted in the printed circuit board (PCB) to dissipate the heat efficiently. Although the effective thermal conductivity of the PCB is important for the thermal management of electronics, measuring the effective thermal conductivity is time-consuming. Therefore, to save time, we focused on the thermal network method and examined the effect of the contraction heat flow around the thermal via on the numerically analyzed effective thermal conductivity of the PCB. The results showed that the contraction heat flow caused by the thermal via affects the range of 7 mm, and the range should be taken care of to express the contraction heat flow appropriately.

引用

页码：109 / 110

页数：2