Thermal nano-probe

被引:49
作者
Rangelow, IW
Gotszalk, T
Abedinov, N
Grabiec, P
Edinger, K
机构
[1] Univ Kassel, IMA, Inst Technol Phys, D-34132 Kassel, Germany
[2] Univ Maryland, College Pk, MD 20742 USA
[3] Wroclaw Univ Technol, Inst Microsyst Technol, PL-50372 Wroclaw, Poland
关键词
scanning thermal microscopy; thermal nano-probe; nanofabrication; focused ion/electron beam technology;
D O I
10.1016/S0167-9317(01)00466-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The novel thermal probe presented here is based on the changes of the electrical resistivity of a nanometer-sized filament with temperature. The filament is integrated into an atomic force scanning probe piezoresistive type cantilever. Using a focused ion beam technique, the front end of the Al meander is cut through, forming an approximately 1-mum wide gap. Employing an electron beam deposition technique a sub-100 nm diameter Pt filament is deposited across the gap. The filament consists of an approximately 2- mum high loop with an additional spike deposited at the apex of the loop to improve spatial resolution. The new probe is an example on how a combination of CMOS technology, bulk and surface micromachining, focused ion beam technology and electron beam-induced deposition can be used to successfully fabricate unique nanoprobes. A spatial resolution of the order of 20 nm and a thermal resolution of 10(-3) K is obtained. (C) 2001 Elsevier Science BY All rights reserved.
引用
收藏
页码:737 / 748
页数:12
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