High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

Future hybrid automotive power train might be integrated to the internal engine combustion environment, due to cost objectives only one water cooling circuitry can be used, this designing involve high temperature working conditions for power electronic semiconductor and packaging. This paper describes the methodology used for different accelerated power cycling tests (PCT) realised on three phase integrated power inverters with a complete monitoring of the 6 switches and on a half bridge. The first results at 150degreesC junction temperature are presented and discussed for the two semiconductor technologies, IGBT and MOSFET modules, considering the objectives of lifetime estimation. (C) 2003 Elsevier Ltd. All rights reserved.