Accurate Simulation of Transistor-Level Variability for the Purposes of TCAD-Based Device-Technology Cooptimization

被引:18
作者
Gerrer, Louis [1 ]
Brown, Andrew R. [2 ]
Millar, Campbell [2 ]
Hussin, Razaidi [3 ]
Amoroso, Salvatore Maria [2 ]
Cheng, Binjie [2 ]
Reid, Dave [2 ]
Alexander, Craig [2 ]
Fried, David [4 ]
Hargrove, Michael [4 ]
Greiner, Ken [4 ]
Asenov, Asen [2 ]
机构
[1] Univ Glasgow, Sch Engn, Device Modelling Grp, Glasgow G4 0BA, Lanark, Scotland
[2] Gold Standard Simulat, Glasgow G12 8LT, Lanark, Scotland
[3] Univ Malaysia Perlis, Sch Microelect Engn, Sch Engn, Device Modelling Grp, Perlis 01000, Malaysia
[4] Coventor Inc, Cary, NC 27513 USA
关键词
Compact model; Design-Technology Co-Optimisation (DTCO); device; simulation; Technology Computer Aided Design (TCAD); variation; virtual fabrication; INTRINSIC PARAMETER FLUCTUATIONS; STATISTICAL VARIABILITY;
D O I
10.1109/TED.2015.2402440
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we illustrate how the predictive Technology Computer Aided Design (TCAD) process device simulation can be used to evaluate process, statistical, and time-dependent variability at the early stage of the development of new technology. This is critically important for the delivery of accurate early Process Design Kits, including process variability, statistical variability, time-dependent variability (degradation) and their interactions and correlations. This is also critical to the TCAD-based Design-Technology Co-Optimisation (DTCO). To accomplish this task, the fast, large area Coventor virtual fabrication platform SEMulator3D was integrated in the Gold-StandradSimulations TCAD-based DTCO tool chain. Published data for Intel 22-nm FinFET technology are used to illustrate and validate the results of the TCAD process and device simulation, the compact model extraction, and the statistical circuit simulation.
引用
收藏
页码:1739 / 1745
页数:7
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