Analysis of self-heating effect and breakdown characteristics in partial SOI LDMOS with multi silicon windows

被引:3
作者
Gao Shan [1 ]
Chen Junning [1 ]
Ke Daoming [1 ]
Fang Miao [1 ]
机构
[1] Anhui Univ, Dept Elect Sci & Technol, Hefei 230029, Peoples R China
来源
ASICON 2007: 2007 7TH INTERNATIONAL CONFERENCE ON ASIC, VOLS 1 AND 2, PROCEEDINGS | 2007年
关键词
D O I
10.1109/ICASIC.2007.4415859
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper proposes a novel partial SOI LDMOS with multi silicon windows. The two-dimensional numerical analysis is performed to investigate the self-heating effects and breakdown characteristics of partial SOI LDMOS. The PSOI devices with multi silicon windows overcome the disadvantages of the conventional PSOI devices and are shown to keep better balance between the self-heating effects and the breakdown voltage which can be optimized at the same time. Furthermore, the drive. current and threshold voltage shift are improved during high-temperature operation effectively. The optimum design of structure for the provided design is also presented according to the synthetical simulations of its performances.
引用
收藏
页码:1237 / 1240
页数:4
相关论文
共 7 条
[1]  
GARNER DM, 1999, 9 INT S SIL INS TECH, P273
[2]   Modelling of self-heating effect in thin SOI and Partial SOI LDMOS power devices [J].
Lim, HT ;
Udrea, F ;
Garner, DM ;
Milne, WI .
SOLID-STATE ELECTRONICS, 1999, 43 (07) :1267-1280
[3]  
PARK JM, 2005, SOLID STATE ELECT, V47, P275
[4]   High-voltage power IC technology with nVDMOS, RESURF pLDMOS, and novel level-shift circuit for PDP scan-driver IC [J].
Sun, WF ;
Shi, LX ;
Sun, ZL ;
Yi, YB ;
Li, HS ;
Lu, SL .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (04) :891-896
[5]  
Udrea F., 1997, 1997 IEEE International SOI Conference Proceedings (Cat. No.97CH36069), P102, DOI 10.1109/SOI.1997.634953
[6]  
UDREA G, 1997, ELECTRON LETT, V10, P907
[7]   Numerical study of self-heating effects of MOSFETs fabricated on SOAN substrate [J].
Zhu, M ;
Chen, P ;
Fu, RKY ;
An, ZH ;
Lin, CL ;
Chu, PK .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2004, 51 (06) :901-906