Research on High Thermal Conductivity of Diamond/Aluminium Composites

被引：0

作者：

Liu, Yong-zheng ^{[1
]}

Cui, Yan ^{[1
]}

机构：

[1] Beijing Insi Aeronaut Mat, Natl Key Lab Adv Composites, Beijing, Peoples R China

来源：

PROCEEDINGS OF THE 7TH NATIONAL CONFERENCE ON CHINESE FUNCTIONAL MATERIALS AND APPLICATIONS (2010), VOLS 1-3 | 2010年

关键词：

composites; high thermal conductivity; diamond/aluminium; MATRIX COMPOSITES; RESISTANCE;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Due to the good physical properties of diamond, diamond/metal composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. Diamond/aluminium composites were produced by pressureless metal infiltration process. Three different diamond single crystals were investigated as Reinforcement. The diamond/aluminium composites have high relative density, and the diamond particles distribute uniformly. The composites exhibite thermal conductivities as high as 559 W/(m.K),and the CTE is 4.37x10(-6)/K.

引用

页码：1828 / 1831

页数：4