Research on High Thermal Conductivity of Diamond/Aluminium Composites

被引：0
|
作者：
Liu, Yong-zheng [1 ]
Cui, Yan [1 ]
机构：
[1] Beijing Insi Aeronaut Mat, Natl Key Lab Adv Composites, Beijing, Peoples R China
来源：
PROCEEDINGS OF THE 7TH NATIONAL CONFERENCE ON CHINESE FUNCTIONAL MATERIALS AND APPLICATIONS (2010), VOLS 1-3 | 2010年
关键词：
composites; high thermal conductivity; diamond/aluminium; MATRIX COMPOSITES; RESISTANCE;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Due to the good physical properties of diamond, diamond/metal composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. Diamond/aluminium composites were produced by pressureless metal infiltration process. Three different diamond single crystals were investigated as Reinforcement. The diamond/aluminium composites have high relative density, and the diamond particles distribute uniformly. The composites exhibite thermal conductivities as high as 559 W/(m.K),and the CTE is 4.37x10(-6)/K.
引用
收藏
页码：1828 / 1831
页数：4
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