Thermal conductance across oxygen-free high-conductivity copper contacts in different environments

被引：1
|
作者：
Kshirsagar, B [1 ]
Nagaraju, J [1 ]
Murthy, MVK [1 ]
机构：
[1] Indian Inst Sci, Dept Instrumentat, Bangalore 560012, Karnataka, India
来源：
JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER | 2003年 / 17卷 / 04期
关键词：
Contact pressure - Heat flow - Thermal conductance - Thermal contact resistance;
D O I：
10.2514/2.7654
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
(Edited Abstract)
引用
收藏
页码：540 / 542
页数：3
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