共 47 条
[6]
Bo Neag A, 2015, BRIEF REV, V809, P449
[8]
Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics
[J].
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,
2019, 125 (08)
[10]
[陈国庆 Chen Guoqing], 2013, [宇航材料工艺, Aerospace Materials & Technology], V43, P30