The Influence of Metal Masks on Matching of the Lower Electrode and a High-Frequency Bias Generator at Reactive Ion Etching of Large Substrates

被引：0

作者：

Poletayev, S. D. ^{[1
,2
]}

Lyubimov, A. I. ^{[3
]}

机构：

[1] State Russian Acad Sci, Image Proc Syst Inst, Fed Res Ctr Crystallog & Photon, Samara 443001, Russia

[2] Samara State Univ, Samara 443086, Russia

[3] State Inst Appl Opt, Kazan 420075, Russia

来源：

TECHNICAL PHYSICS LETTERS | 2021年 / 47卷 / 08期

关键词：

diffraction microrelief; reactive ion etching; impedance; substrate holder; lower electrode; DRY-ETCH;

D O I：

10.1134/S1063785021060122

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The influence of metal masks on matching of the lower electrode and a high-frequency bias generator at selective reactive ion mask etching of large substrates in Freon-14 has been investigated both theoretically and experimentally. It is shown for masks with a coating of substrates of more than 30% that the reactive power component increases at distances from the center that are close to the substrate radius. It is established that the specific reactive power is independent of the thickness and type of metal masks. It is shown experimentally that masks with any substrate-coating coefficient of practical importance connected to the lower electrode via a substrate holder improve matching by decreasing the power reflectance.

引用

页码：569 / 572

页数：4

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