A Vacuum-Based Bonding Mechanism for Modular Robotics

被引：24

作者：

Mendoza Garcia, Ricardo Franco ^{[1
,2
]}

Hiller, Jonathan D. ^{[3
]}

Stoy, Kasper ^{[1
]}

Lipson, Hod ^{[3
]}

机构：

[1] Univ So Denmark, Modular Robot Lab, DK-5230 Odense M, Denmark

[2] Univ Tarapaca, Escuela Univ Ingn Mecan, Arica 1775, Chile

[3] Cornell Univ, Computat Synth Lab, Ithaca, NY 14853 USA

来源：

IEEE TRANSACTIONS ON ROBOTICS | 2011年 / 27卷 / 05期

基金：

美国国家科学基金会;

关键词：

Cellular and modular robots; mechanism design; vacuum connectors;

D O I：

10.1109/TRO.2011.2153010

中图分类号：

TP24 [机器人技术];

学科分类号：

080202 ; 1405 ;

摘要：

We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.

引用

页码：876 / 890

页数：15

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