A MAC scheme with double-side scheduling for ATM-based PON

被引:0
|
作者
Lee, H [1 ]
Lee, D
Oh, C
机构
[1] Kwangju Inst Sci & Technol, Dept Informat & Commun, Kwangju, South Korea
[2] Res Inst Secubay Co, Taejon, South Korea
关键词
APON; MAC; CDV control;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper proposes a new MAC scheme for ATM based Passive Optical Network (APON) a which follows the ITU-T recommendation G.983.1. MAC schemes for APON mostly adopt single-side scheduling in which only OLT (Optical Line Termination) schedules upstream access order for ONUs (Optical Network Units) that inform cell arrival information to OLT. In this paper, we propose a MAC scheme called double-side scheduling protocol (DSP) in which both OLT and ONU participate in scheduling process. Through the computer simulation we find out that the CDV (cell delay variation) performance of the real-time service can be improved remarkably using fewer overhead slots than that of the MAC schemes adopting CDV control algorithm. For the proposed MAC scheme, we present grant field format, minislot format, divided slot format, and scheduling algorithm.
引用
收藏
页码:1690 / 1693
页数:4
相关论文
共 50 条
  • [31] Thermal and reliability characterization of an epoxy resin-based double-side cooled power module
    Cheng T.-H.
    Nishiguchi K.
    Fukawa Y.
    Baliga B.J.
    Bhattacharya S.
    Hopkins D.C.
    Journal of Microelectronics and Electronic Packaging, 2021, 18 (03): : 123 - 136
  • [32] A Novel Double-side Average Equivalent Instantaneous Inductance in Nonsaturation Zone Based Transformer Protection
    Bi, D. Q.
    Li, S. S.
    Wang, X. H.
    Wang, W. J.
    ICEMS 2008: PROCEEDINGS OF THE 11TH INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES AND SYSTEMS, VOLS 1- 8, 2008, : 4364 - +
  • [33] Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
    Chang, Chih-Wei
    Huang, Po-Tsang
    Chou, Lei-Chun
    Wu, Shang-Lin
    Lee, Shih-Wei
    Chuang, Ching-Te
    Chen, Kuan-Neng
    Chiou, Jin-Chern
    Hwang, Wei
    Lee, Yen-Chi
    Wu, Chung-Hsi
    Chen, Kuo-Hua
    Chiu, Chi-Tsung
    Tong, Ho-Ming
    2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC), 2013, 56 : 102 - U882
  • [34] Anion Recognition Based on a Combination of Double-Dentate Hydrogen Bond and Double-Side Anion-π Noncovalent Interactions
    Liu, Yan-Zhi
    Yuan, Kun
    Liu, Liu
    Yuan, Zhao
    Zhu, Yuan-Cheng
    JOURNAL OF PHYSICAL CHEMISTRY A, 2017, 121 (04): : 892 - 900
  • [35] Integrated Optimization on Double-Side Cantilever Yard Crane Scheduling and Green Vehicle Path Planning at U-Shaped Yard
    Peng, Wenhao
    Wang, Dujuan
    Qiu, Huaxin
    Chu, Feng
    Yin, Yunqiang
    IEEE TRANSACTIONS ON INTELLIGENT TRANSPORTATION SYSTEMS, 2025, 26 (03) : 3684 - 3699
  • [36] Double-side pixelated X-ray detector based on metamorphic InGaAs/InAlAs quantum well
    Ganbold, T.
    Antonelli, M.
    Biasiol, G.
    Nichetti, C.
    Cautero, G.
    Menk, R. H.
    JOURNAL OF INSTRUMENTATION, 2019, 14
  • [37] Application of PID Control Based on Repetitive Compensation In Transmission System of Double-Side Blade Grinding Machine
    Yang, Heran
    Zhang, Lei
    Zhang, Zuojie
    Zhao, Guoliang
    OPTICAL, ELECTRONIC MATERIALS AND APPLICATIONS II, 2012, 529 : 339 - 342
  • [38] A novel high selectivity sensor for tetradifon residues based on double-side hollow molecularly imprinted materials
    Yan, Jixian
    Yu, Jinghua
    Zhao, Peini
    Ge, Lei
    Yan, Mei
    Liu, Shiquan
    ANALYTICAL METHODS, 2012, 4 (01) : 177 - 182
  • [39] Investigation of Magnetic Isolation in a Double-Side Asynchronous Rotor-AFPM Machine Based on Harmonic Analysis
    Huang, Rundong
    Zhang, Bowen
    Liu, Yuxin
    Liu, Chunhua
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2025, 72 (01) : 240 - 250
  • [40] Organic vapor sensors based on functionalized macroporous Si using single and double-side electrochemical etching
    Ramirez-Porras, A.
    Fahlman, B. D.
    Badilla, J. P.
    Lopez, V.
    MICROELECTRONIC ENGINEERING, 2012, 90 : 55 - 58