Zirkon(TM) LK2000 version 1 dielectric film (Zirkon(TM) is a trademark of Shipley Company L.L.C), a porous methylsilsesquioxane (MSQ)-based spin-on dielectric with a k value targeted at 2.0, has been integrated in single damascene structures. For patterning, a dual SiC/SiO2 CVD hard-mask was used. Surface treatments (DUV ozone (DUV-O-3), plasma treatments) were tested to solve the adhesion issues encountered at the CVD hard-mask and the low-k interface. Adhesion is only improved when plasma treatments are used. Analyses (FTIR, TDS, nano-indentation) show that the plasma treatments only modify the low-k surface. For integration, a plasma treatment (He, NH3, N-2/O-2) prior to deposition of the CVD hard-mask was included. After patterning, copper metallization and CMP of the wafers, electrical evaluation shows that, compared to the reference wafer (no plasma treatment), plasma-treated wafers have a higher yield and a lower sheet resistance. The RC delay is slightly higher for the plasma-treated wafers than for the reference wafer. (C) 2003 Elsevier B.V. All rights reserved.
